The full name of BGA is Ball Grid Array (PCB with ball grid array structure), which is a packaging method for integrated circuits using organic carrier boards. it has:
①The packaging area is reduced
②The function increases, the number of pins increases
③The PCB board can be self-centered and easy to tin
④High reliability ⑤Good electrical performance and low overall cost. PCB boards with BGA generally have many small holes. Most customers' BGA vias are designed with a finished hole diameter of 8-12mil. The distance between the surface of the BGA and the hole is 31.5mil as an example, generally not less than 10.5mil. BGA via holes need to be plugged, BGA pads are not allowed to be filled with ink, and BGA pads are not drilled.